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bly i loddemateriale til at fastgøre heat spreader til heat sink i halvlederenheder med en chip mindst på en størrelse af 1 cm2 af projektionsoverfladen og en nominel strømtæthed på mindst 1 a/mm2 af siliciumchipområdet
lead in solder to attach heat spreaders to the heat sink in power semiconductor assemblies with a chip size of at least 1 cm2 of projection area and a nominal current density of at least 1 a/mm2 of silicon chip area