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8 g) bly i lod för elektrisk koppling mellan halvledarchip och substrat i flip-chip-komponenter
lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
5 ml injektionsflaska (klart typ 1-glas) med propp (klorbutylgummi), försegling (aluminium) och flip-off-kapsyl (polypropen).
5 ml vial (type 1 clear glass) with a stopper (chlorobutyl rubber), seal (aluminium) and a flip-off cap (polypropylene).