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fc-pga는 flip chip pin grid array의 약어로, 이러한 패키지에는 소켓에 들어갈 핀이 있습니다.
the fc-pga package is short for flip chip pin grid array, which have pins that are inserted into a socket.

모바일 <PROTECTED>-<PROTECTED>(<PROTECTED> flip chip pin grid array)와 <PROTECTED>-<PROTECTED>(<PROTECTED> flip chip ball grid array) 패키징 기술은 이전 기술에 비해 전력 전달과 핀 인덕턴스를 크게 개선하여 성능을 상당히 높입니다.
the mobile <PROTECTED>-<PROTECTED> (micro flip chip pin grid array) and <PROTECTED>-<PROTECTED> (micro flip chip ball grid array) packaging technology provides significant improvements in power delivery and pin inductance compared to their predecessors resulting in dramatically improved performance.