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bonding
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Last Update: 2010-11-29 Usage Frequency: 3 Quality: Reference: Wikipedia
ensure processor and heatsink bonding surfaces are free from previously applied thermal interface material, oil, dust, and any other debris.
프로세서와 방열판 접합 표면에 이전에 바른 감열재, 오일, 먼지 및 기타 부스러기가 없어야 합니다.
Last Update: 1970-01-01 Usage Frequency: 1 Quality: Reference: Wikipedia
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