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in electronics assembly, the eutectic alloy of 63% tin and 37% lead (or 60/40, which is almost identical in melting point) has been the alloy of choice.
Örneğin elektronik devre montajında 63% kalay ve 37% kurşun, ötektik alaşımı (ya da performansı ötektik olana çok yakın 60/40) tercih edilir.
