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das offset placement after soldering system überprüft die lotpastenposition relativ zur pad position und platziert anschliessend die komponenten korrekt auf die solderpaste anstatt aufs pad, was die prozessgenauigkeit, insbesondere bei der platzierung von sehr kleinen bauteilen, deutlich verbessert.
the offset placement after soldering system checks the solder paste position related to the pad location. components are placed centered on the solder paste print instead of the pads which increases dramatically the process accuracy specially for very small component placement.
Last Update: 2018-02-13
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