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strahlungsplatten- und leistungshalbleitermodul, ic-baustein
radiation plate and power semiconductor module; ic package
Last Update: 2014-11-28
Usage Frequency: 2
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antennenvorrichtung nach anspruch 14, dadurch gekennzeichnet, dass ein kapazitives element und/oder ein induktives element zwischen den schlitzen und/oder zwischen der strahlungsplatte und der erdungsplatte angebracht oder ausgebildet sind.
the antenna device as defined in claim 14, wherein at least one of a capacitance element and an inductance element is one of added to and formed on at least one of between said slits and between said radiating plate and said grounding plate.
Last Update: 2014-12-05
Usage Frequency: 8
Quality: