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(controlled nucleation thermal deposition) irányított gócképződésű termikus rétegleválasztás
“average output power” (6) means the total “laser” output energy in joules divided by the “laser duration” in seconds.
* a 2005 lawsuit alleges that since 1993 there were at least 16 in-flight fires or thermal incidents involving the no.
a 2005 lawsuit alleges that since 1993 there were at least 16 in-flight fires or thermal incidents involving the no.
installations for the drying or calcination of gypsum or for the production of plaster boards and other gypsum products, where combustion installations with a rated thermal input exceeding 20 mw are operated.
gipszszárításra vagy –kalcinálásra, illetve gipszkarton és más gipsztermékek előállítására használt létesítmények, amennyiben 20 mw-ot meghaladó bemenő hőteljesítményű tüzelőberendezéseket működtetnek.
the coniferous lumber to which this certificate applies has been dried in a klin, and during the process, has achieved thermal death times for pinewood nematode (pwn) and its vector.
the coniferous lumber to which this certificate applies has been dried in a klin, and during the process, has achieved thermal death times for pinewood nematode (pwn) and its vector.
it will demonstrate that the system can feasibly produce significant amounts of electrical energy; that ashes produced from sludge incineration are suitable for co2 sequestration; and that the system can withstand the thermal shocks that are induced by the frequent shutdowns.
it will demonstrate that the system can feasibly produce significant amounts of electrical energy; that ashes produced from sludge incineration are suitable for co 2 sequestration; and that the system can withstand the thermal shocks that are induced by the frequent shutdowns.
a cvd-eljárások közé tartoznak a következők is: nem pack (out-of-pack) irányított gázáram, pulzáló cvd, szabályozott nukleidos termikus leválasztás (controlled nucleation thermal decomposition – cntd), plazmagerjesztésű vagy plazmát alkalmazó cvd-eljárások.
cvd includes the following processes: directed gas flow out-of-pack deposition, pulsating cvd, controlled nucleation thermal deposition (cntd), plasma enhanced or plasma assisted cvd processes.