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solderability of sn 0.7cu solder alloy was evaluated by soldering on the textured of aluminium substrate. the sample of aluminium alloy will be prepared by cutting,grinding,and polishing the sample. the pattern of the aluminium substrate was done by photolithographic method that transfer the surface of square grid geometric on the aluminium substrate. this process begins with the coating of a planar substrate in liquid form with the photoresist. the substrate is "soft baked after the coating pr
solderability sn 0.7cu alloy solder telah dinilai oleh penyolderan pada substrat aluminium bertekstur. sampel aloi aluminium akan disediakan dengan memotong, mengisar, dan menggilap sampel. corak substrat aluminium dilakukan oleh kaedah photolithographic yang memindahkan permukaan geometri grid persegi pada substrat aluminium. proses ini bermula dengan pelapisan substrat planar dalam bentuk cecair dengan photoresist. substrat adalah "lembut dibakar selepas salutan pr