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encapsulamento micro-pga2
micro-pga2 package
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
encapsulamento micro-bga2
micro-bga2 package
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
marcações do encapsulamento micro-fcpga
micro-fcpga package markings
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
o encapsulamento micro-fcpga é usado pelo processador.
the micro-fcpga package is used by the processor.
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
processadores intel® pentium® iii para portáteis (encapsulamento micro-pga2)
mobile intel® pentium® iii processors (micro-pga2 package)
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
processador pentium iii para portáteis (encapsulamento micro-fcpga)
mobile pentium iii processor (micro-fcpga package)
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
manual de instalação (tipo de encapsulamento micro-fcpga) [pdf]
installation manual (micro-fcpga package) [pdf]
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
manual de instalação (tipo de encapsulamento micro-fcpga) [pdf]
installation manual (micro-fcpga package) [pdf]
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
processador intel pentium 4 - m para portáteis (encapsulamento micro-fcpga)
mobile intel pentium 4 processor - m (micro-fcpga package)
Last Update: 1970-01-01
Usage Frequency: 2
Quality:
qual a diferença entre micro-pga2 e micro-fcpga?
what is the difference between micro-pga2 and micro-fcpga?
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
o micro-pga2 consiste em um encapsulamento bga montado sobre um espaçador com pequenos pinos.
the micro-pga2 consists of a bga package mounted to an interposer with small pins.
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
o encapsulamento micro-fcpga (flip chip plastic grid array) consiste em uma matriz colocada com a face voltada para baixo sobre um substrato orgânico.
the micro-fcpga (flip chip plastic grid array) package consists of a die placed face-down on an organic substrate.
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
mobile intel® pentium® 4 processors - m - manual de instalação (tipo de encapsulamento micro-fcpga) [pdf]
mobile intel® pentium® 4 processors - m - installation manual (micro-fcpga package) [pdf]
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
o encapsulamento micro-fcbga (flip chip ball grid array), para montagem na superfície da placa, consiste em uma matriz colocada com a face voltada para baixo sobre um substrato orgânico.
micro-fcbga (flip chip ball grid array) package for surface mount boards consists of a die placed face-down on an organic substrate.
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
embora haja vários designs de soquetes micro-pga2 disponíveis, todos eles foram projetados para permitir a colocação e a remoção do processador pentium iii para portáteis com “força de inserção zero” (zif - zero insertion force).
while there are several micro-pga2 socket designs available, all of them are designed to allow zero-insertion force removal and insertion of the mobile pentium iii processor.
Last Update: 1970-01-01
Usage Frequency: 1
Quality:
